Submissions For The TEMSCON Global Program

TEMSCON Global welcomes submissions of full papers and short papers. Manuscripts that are accepted and presented will be submitted for inclusion in the IEEE Xplore® digital library and indexed by EI/Compendex. Authors of selected papers will be invited to submit extended versions for potential publication in special issues of IEEE Transactions on Engineering Management and IEEE Engineering Management Review. Proposals for workshops and invited sessions are also welcome.

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Topics of Interest

(Partial List)

  • Agentic and generative AI

  • Machine learning and data analytics

  • Edge and cloud computing

  • Blockchain and distributed ledgers

  • Cybersecurity and quantum

  • Management of engineering organizations

  • Innovation and entrepreneurship

  • R&D and NPD management

  • Supply chain and operations

  • Digital transformation

  • Aerospace and defense

  • Software and services

  • Sustainability and climate change

  • Smart cities and infrastructure

  • Smart manufacturing and logistics

  • Science and technology policy

  • Regulation and compliance

  • Ethics of artificial intelligence

  • National industrial policy

  • Technology transfer